description these tinted difused led lamps are designed and opti - mized specifcally for low dc current operation. luminous intensity and forward voltage are tested at 2 ma to assure consistent brightness at ttl output current levels. applications ?? low power dc circuits ?? telecommunications indicators ?? portable equipment ?? keyboard indicators HLMP-4700, hlmp-4719, hlmp-4740 hlmp-1700, hlmp-1719, hlmp-1790 t-1 3 / 4 (5 mm), t-1 (3 mm), low current led lamps data sheet HLMP-4700, -4719, -4740 a hlmp-1700, -1719, -1790 b features ?? low power ?? high efciency ?? cmos-mos compatible ?? ttl compatible ?? wide viewing angle ?? choice of package styles ?? choice of colors package dimensions 25.40(1.00) minimum 2.54 (0.100) nom. 0.55 (0.022) 0.40 (0.016) 6.10 (0.240) 5.59 (0.220) 1.27(0.050) nom. 0.89 (0.035) 0.64 (0.025) 5.08 (0.200) 4.57 (0.180) 9.19 (0.362) 8.43 (0.332) square typ. cathode lead 0.65 (0.026) max 0.65 (0.026) max. 24.1(.95) min. 4.70 (.185) 4.19 (.165) 3.43 (.135) 2.92 (.115) 1.52 (.060) 1.02 (.040) 2.79 (.110) 2.29 (.090) 1.14 (.045) 0.51 (.020) (0.022) 0.55 sq. typ. (0.016) 0.40 ? 3.17 (.125) 2.67 (.105) 6.35 (.250) 5.58 (.220) notes: 1. all dimensions are in mm (inches). 2. an epoxy meniscus may extend about 1 mm (0.040") down the leads. 3. for pcb hole recommendations, see the precautions section.
2 selection guide device hlmp- luminous intensity iv (mcd) at 2 ma package outline package description color min. typ. max. 2 q 1/2 t-1 3/4 tinted difused red 4700 1.5 2.3 C 50 a 4700-c00xx 1.5 2.3 C 4700-cd0fh 1.5 2.3 4.2 yellow 4719 0.9 2.1 C 4719-a00xx 0.9 2.1 C green 4740 1.0 2.3 C 4740-a00xx 1.0 2.3 C 4740-ab000 1.0 2.3 3.2 t-1 tinted difused red 1700 0.8 2.1 C 50 b 1700-b00xx 0.8 2.1 C yellow 1719 0.9 2.1 C 1719-a00xx 0.9 2.1 C 1719-abb00 0.9 2.1 2.8 green 1790 1.0 2.3 C 1790-a00xx 1.0 2.3 C 1790-ab0fh 1.0 2.4 3.2 note: 1. q 1/2 is the typical of-axis angle at which the luminous intensity is half the axial luminous intensity.
3 part numbering system hlmp ? x 7 xx - x x x xx mechanic al o ption 00: bulk 01: tape & reel, crimped leads 02, bh: tape & reel, straight leads a1, b1: right angle housing, uneven leads a2, b2: right angle housing, even leads fh: 2 iv bins select with inventory control c olor bin o ptions 0: full color bin distribution b: color bins 2 & 3 only maximum i v bin o ptions 0: open (no. max. limit) others: please refer to the iv bin table minimu m i v bin o ptions p lease r ef er t o the i v bin t able c olor o ptions 00: gap her 19: gap yellow 40: gap green 90: gap green p ack age o ptions 4: t-1 3 / 4 (5 mm) 1: t-1 (3 mm)
4 electrical/optical characteristics at t a = 25c symbol description t-1 3 / 4 t-1 min. typ. max. units test conditions v f forward voltage 4700 1700 1.7 2.0 v 2 ma 4719 1719 1.8 2.5 4740 1790 1.9 2.2 v r reverse breakdown 4700 1700 5.0 v i r = 50 a voltage 4719 1719 5.0 4740 1790 5.0 l d dominant 4700 1700 626 nm note 1 wavelength 4719 1719 585 4740 1790 569 dl 1/2 spectral line 4700 1700 40 nm halfwidth 4719 1719 36 4740 1790 28 t s speed of response 4700 1700 90 ns 4719 1719 90 4740 1790 500 c capacitance 4700 1700 11 pf v f = 0, 4719 1719 15 f = 1 mhz 4740 1790 18 r q j-pin thermal resistance 4700 1700 260 [3] c/w junction to cathode lead 4719 1719 290 [4] 4740 1790 l peak peak wavelength 4700 1700 635 nm measurement at peak 4740 1790 565 h v luminous efcacy 4700 1700 145 lumens/watt note 2 4719 1719 500 4740 1790 595 notes: 1. the dominant wavelength, l d , is derived from the cie chromaticity diagram and represents the single wavelength which defnes the color of the device. 2. the radiant intensity, i e , in watts per steradian, may be found from the equation i e = i v / h v , where i v is the luminous intensity in candelas and h v is luminous efcacy in lumens/watt. 3. t-1 3 / 4 . 4. t-1.
5 absolute maximum ratings parameter maximum rating units power dissipation (derate linearly from 92c at 1.0 ma/c) red yellow green 14 17.5 15.4 mw dc and peak forward current 7 ma transient forward current (10 s pulse) [1] 500 ma reverse voltage (i r = 50 a) 5.0 v operating temperature range red/yellow green -40 to 100 -20 to 100 c c storage temperature range -40 to +100 c notes: 1. the transient peak current is the maximum non-recurring peak current the devices can withstand without damaging the led die and wire bonds. it is not recommended that the device be operated at peak currents beyond the absolute maximum peak forward current. dc current ? ma 0 0 voltage ? v 1.5 6 0.5 1.0 2.5 2 4 8 10 2.0 red yellow green relative luminous intensity (normalized at 2ma) 0 0 i dc -dc current per led - ma 6 6.0 2 4 10 2.0 4.0 8.0 10.0 8 red yellow green t a - 25c yellow wavelength ? nm relative intensity 1.0 0.5 0 500 550 600 650 700 750 green t a = 25 c red figure 1. relative intensity vs. wavelength. figure 2. forward current vs. forward voltage. figure 3. relative luminous intensity vs. forward current.
6 figure 4. relative luminous intensity vs. angular displacement for t-1 3 / 4 lamp. figure 5. relative llluminous intensity vs. angular displacement for t-1 lamp. intensity bin limits intensity range (mcd) color bin min. max. red b 0.9 1.5 c 1.5 2.4 d 2.4 3.8 e 3.8 6.1 f 6.1 9.7 g 9.7 15.5 h 15.5 24.8 i 24.8 39.6 j 39.6 63.4 k 63.4 101.5 l 101.5 162.4 m 162.4 234.6 n 234.6 340.0 o 340.0 540.0 p 540.0 850.0 q 850.0 1200.0 r 1200.0 1700.0 s 1700.0 2400.0 t 2400.0 3400.0 u 3400.0 4900.0 v 4900.0 7100.0 w 7100.0 10200.0 x 10200.0 14800.0 y 14800.0 21400.0 z 21400.0 30900.0 maximum tolerance for each bin limit is 18%. 10 100 40 70 20 60 80 30 50 90 relative intensity 1.0 0.8 0.6 0.4 0.2 0.0 0 10 40 70 20 60 80 30 50 90 10 100 40 70 20 60 80 30 50 90 relative intensity 1.0 0.8 0.6 0.4 0.2 0.0 0 10 40 70 20 60 80 30 50 90 intensity bin limits intensity range (mcd) color bin min. max. yellow a 1.0 1.6 b 1.6 2.5 c 2.5 4.0 d 4.0 6.5 e 6.5 10.3 f 10.3 16.6 g 16.6 26.5 h 26.5 42.3 i 42.3 67.7 j 67.7 108.2 k 108.2 173.2 l 173.2 250.0 m 250.0 360.0 n 360.0 510.0 o 510.0 800.0 p 800.0 1250.0 q 1250.0 1800.0 r 1800.0 2900.0 s 2900.0 4700.0 t 4700.0 7200.0 u 7200.0 11700.0 v 11700.0 18000.0 w 18000.0 27000.0 maximum tolerance for each bin limit is 18%.
7 intensity bin limits intensity range (mcd) color bin min. max. green a 1.1 1.8 b 1.8 2.9 c 2.9 4.7 d 4.7 7.6 e 7.6 12.0 f 12.0 19.1 g 19.1 30.7 h 30.7 49.1 i 49.1 78.5 j 78.5 125.7 k 125.7 201.1 l 201.1 289.0 m 289.0 417.0 n 417.0 680.0 o 680.0 1100.0 p 1100.0 1800.0 q 1800.0 2700.0 r 2700.0 4300.0 s 4300.0 6800.0 t 6800.0 10800.0 u 10800.0 16000.0 v 16000.0 25000.0 w 25000.0 40000.0 maximum tolerance for each bin limit is 18%. color categories lambda (nm) color category # min. max. 6 561.5 564.5 5 564.5 567.5 green 4 567.5 570.5 3 570.5 573.5 2 573.5 576.5 1 582.0 584.5 3 584.5 587.0 yellow 2 587.0 589.5 4 589.5 592.0 5 592.0 593.0 tolerance for each bin limit is 0.5 nm. mechanical option matrix mechanical option code defnition 00 bulk packaging, minimum increment 500 pc/bag 01 tape & reel, crimped leads, min. increment 1300 pcs/bag for t-1 3/4, 1800 pcs/bag for t-1 02 tape & reel, straight leads, min. increment 1300 pcs/bag for t-1 3/4, 1800 pcs/bag for t-1 a1 t-1, right angle housing, uneven leads, minimum increment 500 pcs/bag a2 t-1, right angle housing, even leads, minimum increment 500 pcs/bag b1 t-1 3/4, right angle housing, uneven leads, minimum increment 500 pcs/bag b2 t-1 3/4, right angle housing, even leads, minimum increment 500 pcs/bag bh t-1, tape & reel, straight leads, minimum increment 2000 pcs/bag fh devices that require inventory control and 2 iv bin select r1 tape & reel, crimped leads, reeled counter clockwise, cathode lead leaving the reel frst notes: all categories are established for classifcation of products. products may not be available in all categories. please contact your local avago representative for further clarifcation/information.
8 precautions: lead forming: ? the leads of an led lamp may be preformed or cut to length prior to insertion and soldering on pc board. ? for better control, it is recommended to use proper tool to precisely form and cut the leads to applicable length rather than doing it manually. ? if manual lead cutting is necessary, cut the leads after the soldering process. the solder connection forms a mechanical ground which prevents mechanical stress due to lead cutting from traveling into led package. this is highly recommended for hand solder operation, as the excess lead length also acts as small heat sink. soldering and handling: ? care must be taken during pcb assembly and soldering process to prevent damage to the led component. ? led component may be efectively hand soldered to pcb. however, it is only recommended under unavoidable circumstances such as rework. the closest manual soldering distance of the soldering heat source (soldering irons tip) to the body is 1.59mm. soldering the led using soldering iron tip closer than 1.59mm might damage the led. ? esd precaution must be properly applied on the soldering station and personnel to prevent esd damage to the led component that is esd sensitive. do refer to avago application note an 1142 for details. the soldering iron used should have grounded tip to ensure electrostatic charge is properly grounded. ? recommended soldering condition: wave manual solder soldering [1],[2] dipping pre-heat temperature 105c max. C pre-heat time 60 sec max. C peak temperature 250c max. 260c max. dwell time 3 sec max. 5 sec max. note: 1) above conditions refers to measurement with thermocouple mounted at the bottom of pcb. 2) it is recommended to use only bottom preheaters in order to reduce thermal stress experienced by led. ? wave soldering parameters must be set and maintained according to the recommended temperature and dwell time. customer is advised to perform daily check on the soldering profle to ensure that it is always conforming to recommended soldering conditions. note: 1. pcb with diferent size and design (component density) will have diferent heat mass (heat capacity). this might cause a change in temperature experienced by the board if same wave soldering setting is used. so, it is recommended to re-calibrate the soldering profle again before loading a new type of pcb. 2. customer is advised to take extra precaution during wave soldering to ensure that the maximum wave temperature does not exceed 250c and the solder contact time does not exceeding 3sec. over- stressing the led during soldering process might cause premature failure to the led due to delamination. ? any alignment fxture that is being applied during wave soldering should be loosely ftted and should not apply weight or force on led. non metal material is recommended as it will absorb less heat during wave soldering process. ? at elevated temperature, led is more susceptible to mechanical stress. therefore, pcb must allowed to cool down to room temperature prior to handling, which includes removal of alignment fxture or pallet. ? if pcb board contains both through hole (th) led and other surface mount components, it is recommended that surface mount components be soldered on the top side of the pcb. if surface mount need to be on the bottom side, these components should be soldered using refow soldering prior to insertion the th led. ? recommended pc board plated through holes (pth) size for led component leads. led component lead size diagonal plated through- hole diameter lead size (typ.) 0.45 0.45 mm (0.018 0.018 in.) 0.636 mm (0.025 in) 0.98 to 1.08 mm (0.039 to 0.043 in) dambar shear- of area (max.) 0.65 mm (0.026 in) 0.919 mm (0.036 in) lead size (typ.) 0.50 0.50 mm (0.020 0.020 in.) 0.707 mm (0.028 in) 1.05 to 1.15 mm (0.041 to 0.045 in) dambar shear- of area (max.) 0.70 mm (0.028 in) 0.99 mm (0.039 in) note: refer to application note an1027 for more information on soldering led components. ? over-sizing the pth can lead to twisted led after clinching. on the other hand under sizing the pth can cause difculty inserting the th led. refer to application note an5334 for more information about soldering and handling of th led lamps. 1.59 mm
9 example of wave soldering temperature profle for th led 0 10 20 30 40 50 60 70 80 90 100 250 200 150 100 50 time (minutes) preheat turbulent wave laminar hot air knife temperature (c) recommended solder: sn63 (leaded solder alloy) sac305 (lead free solder alloy) flux: rosin ?ux solder bath temperature: 245c 5c (maximum peak temperature = 250c) dwell time: 1.5 sec ? 3.0 sec (maximum = 3sec) note: allow for board to be su?ciently cooled to room temperature before exerting mechanical force. recommended solder: sn63 (leaded solder alloy) sac305 (lead free solder alloy) flux: rosin ?ux solder bath temperature: 245c 5c (maximum peak temperature = 250c) dwell time: 1.5 sec ? 3.0 sec (maximum = 3sec) note: allow for board to be su?ciently cooled to room temperature before exerting mechanical force. packaging label: (i) avago mother label: (available on packaging box of ammo pack and shipping box) (1p) ite m: part number (1t) lot: lot number lpn: (9d)mfg date: manufacturing date (p) customer item: (v) vendor id : deptid: made in: country of origin (q) qty: quantity cat: intensity bin bin: color bin (9d) date code: date code standard label ls0002 rohs compliant e3 max temp 250c (1p) part # : part number (1t) lot #: lot number (9d)mfg date: manufacturing date c/o: country of origin customer p/n: supplier code: quantity: packing quantity cat: intensity bin bin: color bin datecode: date code rohs compliant e3 max tem p 250c lam p s bab y label
for product information and a complete list of distributors, please go to our web site: www.avagotech.com avago, avago technologies, and the a logo are trademarks of avago technologies in the united states and other countries. data subject to change. copyright ? 2005-2013 avago technologies. all rights reserved. obsoletes 5989-4256en av02-1557en - june 7, 2013 (ii) avago baby label (only available on bulk packaging) (1p) ite m: part number (1t) lot: lot number lpn: (9d)mfg date: manufacturing date (p) customer item: (v) vendor id : deptid: made in: country of origin (q) qty: quantity cat: intensity bin bin: color bin (9d) date code: date code standard label ls0002 rohs compliant e3 max temp 250c (1p) part # : part number (1t) lot #: lot number (9d)mfg date: manufacturing date c/o: country of origin customer p/n: supplier code: quantity: packing quantity cat: intensity bin bin: color bin datecode: date code rohs compliant e3 max tem p 250c lam p s bab y label
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